《MEMS麦克风逆向工程和成本分析》
2012-06-23 15:08:10   来源:Yole   评论:0   点击:

近期,Yole发布了《MEMS麦克风逆向工程和成本分析》,囊括市场上6款MEMS麦克风,并对每款麦克风都进行工艺流程、制造环境、封装和成本分析。

购买该报告请联系:
中国微纳技术俱乐部 王先生
电话:18217468860;电子邮箱:wangyi#micro-nano.com(#换成@)
注:2012年7月31日前购买,享有9折优惠!

以下为《MEMS麦克风逆向工程和成本分析》报告精彩提要:

内容概要:

* 6款MEMS麦克风的完整逆向工程和成本分析

* 针对每款麦克风,包含以下几点:
(1)工艺流程
(2)制造环境(前端和后端)
(3)MEMS和ASIC的制造成本
(4)封装

* 各款麦克风分析和比较:
(1)前端技术/工艺选择
(2)封装技术/工艺选择
(3)生产设施和成本
(4)各款麦克风对比和趋势分析

* 电话会议和Q&A环节:回答客户的问题

已经分析的6款MEMS麦克风:
AAC Acoustic: SM0401、Akustica: AKU230、Analog Devices: ADMP421、EPCOS: T4000/T4060、Knowles: SPU0409/SPU0410和ST: MP45DT01

   6款MEMS麦克风:瑞声科技、Akustica、ADI、ST、楼氏和EPCOS   

以下是报告图片掠影:

    X射线照射的麦克风图片    

    MEMS麦克风封装分析    

     麦克风开盖后的MEMS和ASIC     

     MEMS麦克风结构图     

      麦克风的ASIC分析      

      MEMS麦克风的音空      

       MEMS麦克风的工艺流程       

       MEMS麦克风前道工艺成本分析       

        MEMS麦克风后道工艺材料成本分析        

报告目录:

Glossary

1. Overview / Introduction
– Executive Summary
– Reverse Costing Methodology

2. Knowles Company Profile
– Knowles Profile
– MEMS Microphone Portfolio
– SPU0410LR5H Characteristics
– Knowles Business Model

3. Physical Analysis
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Package Characteristics & Markings
– Package Pin-Out
– Package Cross-Section
– Device Structure
– Package Opening
– ASIC Dimensions
– ASIC Markings
– ASIC Cross-Section
– ASIC Delayering
– ASIC Process Characteristics
– MEMS Dimensions
– MEMS Markings
– MEMS Surface
– MEMS Structure
– MEMS Cross-section
– MEMS Process Characteristics
– Physical Data Summary

4. Manufacturing Process Flow
– Global Overview
– ASIC Process Flow
– Description of the ASIC Wafer Fabrication Unit
– MEMS Process Flow
– Description of the MEMS Wafer Fabrication Unit
– Packaging Process Flow
– Description of the Packaging Unit

5. Cost Analysis
– Synthesis of the Cost Analysis
– Main Steps of Economic Analysis
– Yields Explanation
– Yields Hypotheses
– Die per wafer & Probe Test
– ASIC Front-End : Hypotheses
– ASIC Front-End Cost
– ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
– ASIC Die Cost
– MEMS Front-End : Hypotheses
– MEMS Front-End Cost
– MEMS Front-End Cost per Process Steps
– MEMS Front-End : Equipment Cost per Family
– MEMS Front-End : Material Cost per Family
– MEMS Back-End 0 : Probe Test & Dicing
– MEMS Die Cost (Front End + Back End 0)
– Back-End 1 : Packaging Cost
– Back-End 1 : Final test & Calibration Cost
– SPU0410LR5H Component Cost (FE + BE 0 + BE 1)

6. Estimated Price Analysis
– Definition of Prices
– Manufacturer Financial Ratios
– SPU0410LR5H Estimated Manufacturer Price

Contact

如有需求,请联系王先生(wangyi@micro-nano.com)获取《MEMS麦克风逆向工程和成本分析》样刊。

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