《3轴MEMS加速度计:LIS3DH / A2L》
2012-04-29 11:09:54   来源:Yole   评论:0   点击:

Yole发布了STMicroelectronics的3轴MEMS加速度计(LIS3DH和A2L)的拆解和工艺成本分析报告。

购买该报告请联系:
中国微纳技术俱乐部 王先生
电话:18217468860;电子邮箱:wangyi#micro-nano.com(#换成@)

以下为《3轴MEMS加速度计:ST LIS3DH / A2L》报告精彩提要:

拆解和逆向成本分析

Yole发布了STMicroelectronics的3轴MEMS加速度计:LIS3DH和A2L(专为Apple定制)的逆向成本分析报告。LIS3DH是ST “nano”产品系列的首个线性3轴加速度计,封装为3.0x3.0x1.0mm,超低功耗适用于各种消费类移动产品应用,如智能手机、平板电脑。

LIS3DH

A cavity in the Cap is etched only above the Z-axis of the sensor

A2L也是一款3轴MEMS加速度计,MEMS芯片部分与LIS3DH相同,但是封装尺寸更小,为2.0x2.0x1.0mm,A2L最先应用在Apple iPod Nano 6G中。

 Apple A2L 

 LIS3DH & A2L 封装比较 

上图为LIS3DH,下图为A2L,可见封装尺寸的减小

相比ST先前的惯性传感器中使用的THELMA工艺,LIS3DH / A2L采用了新的金金热压键合工艺,使得MEMS芯片面积比先前的3轴加速度计LIS331DLH缩小一半。由于MEMS芯片和ASIC芯片同时减小,所以这种新一代"nano"加速度计的制造成本已大幅降低,以适应消费电子应用的价格压力。

   LIS3DH / A2L成本分析   

LIS3DH / A2L成本分析

报告内容:

该报告提供了完整的3轴MEMS加速度计拆解内容和每步工艺成本分析:
* 清楚详细的照片
* 器件材料分析
* 组装示意图说明
* 制造流程
* 深入的经济分析
* 制造成本构成
* 售价预估

谁应该购买这份报告?

OEM公司、MEMS代工厂/制造商、半导体设备和材料供应商:
* 供应链管理人员
* 采购经理
* 产品经理
* 技术研发人员

目录:

Glossary

Overview/Introduction
• Executive Summary
• Reverse Costing Methodology

STMicroelectronics Company Profile

iPod Nano 6G Teardown

Physical analysis
•Synthesis of the Physical Analysis
•Physical Analysis Methodology
•Package Characteristics & Markings (LIS3DH)
•Package Characteristics & Markings (A2L)
•Package Pin-Out
•Package X-Ray
•Package Cross-Section
•Device Structure
•Package Opening (LIS3DH)
•Package Opening (A2L)
•ASIC – Dimensions (LIS3DH)
•ASIC – Dimensions (A2L)
•ASIC – Markings
•ASIC – Bond Pads
•ASIC – MIM Capacitors
•ASIC – Delayering
•ASIC – Cross-Section
•ASIC – Process Characteristics
•MEMS – Dimensions (LIS3DH)
•MEMS – Dimensions (A2L)
•MEMS – Markings
•MEMS – Bond Pads Opening
•MEMS – Bond Pads
•MEMS – Cap Opening
•MEMS – Cap
•MEMS – Sealing Frame
•MEMS – Comparison with Previous Generation
•MEMS – Sensor Optical Overview
•MEMS – Sensor SEM Overview
•MEMS Sensor – X/Y Axes
•MEMS Sensor – Z Axis
•MEMS Sensor – Masses Removed
•MEMS – Cross-Section
•MEMS Process Characteristics
•Physical Data Summary

Manufacturing Process Flow
•Global Overview
•ASIC Process Flow
•Description of the ASIC Wafer Fabrication Unit
•MEMS Process Overview
•MEMS Sensor Process Flow
•MEMS Cap Process Flow
•MEMS Wafer Bonding Process Flow
•Description of the MEMS Wafer Fabrication Unit

Cost Analysis
•Synthesis of the Cost Analysis
•Main Steps of Economic Analysis
•Yields Explanation
•Yields Hypotheses
•Die per wafer & Probe Test
•ASIC Front-End : Hypotheses
•ASIC Front-End Cost
•ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
•ASIC Die Cost
•MEMS Front-End : Hypotheses
•MEMS Front-End Cost
•MEMS Front-End Cost per Process Steps
•MEMS Front-End : Equipment Cost per Family
•MEMS Front-End : Material Cost per Family
•MEMS Back-End 0 : Probe Test & Dicing
•MEMS Die Cost (Front End + Back End 0)
•Back-End 1 : Packaging Cost (LIS3DH / A2L)
•Back-End 1 : Final test & Calibration Cost
•LIS3DH Component Cost (FE + BE 0 + BE 1)
•A2L Component Cost (FE + BE 0 + BE 1)

Estimated Manufacturer Price Analysis
•Definition of Prices
•Manufacturer Financial Ratios
•LIS3DH Estimated Manufacturer Price
•LIS3DH Estimated Selling Price
•A2L Estimated Manufacturer Price
•A2L Estimated Selling Price

Conclusion

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相关热词搜索:MEMS加速度计

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